US 12,474,217 B2
Inspection method
Teppei Nomura, Tokyo (JP); Zhiwen Chen, Tokyo (JP); and Youngsuk Kim, Tokyo (JP)
Assigned to DISCO CORPORATION, Tokyo (JP)
Filed by DISCO CORPORATION, Tokyo (JP)
Filed on Mar. 31, 2023, as Appl. No. 18/193,766.
Claims priority of application No. 2022-061884 (JP), filed on Apr. 1, 2022.
Prior Publication US 2023/0314234 A1, Oct. 5, 2023
Int. Cl. B23K 1/00 (2006.01); B23K 1/005 (2006.01); B23K 26/03 (2006.01); G01J 5/08 (2022.01); G01J 5/48 (2022.01); B23K 101/40 (2006.01); G01J 5/00 (2022.01)
CPC G01J 5/485 (2022.01) [B23K 1/0016 (2013.01); B23K 1/0056 (2013.01); B23K 26/034 (2013.01); G01J 5/0859 (2013.01); B23K 2101/40 (2018.08); G01J 2005/0077 (2013.01)] 4 Claims
OG exemplary drawing
 
1. An inspection method for inspecting a bonded state between a semiconductor chip and a board, the inspection method comprising:
a preparing step of preparing a workpiece including a semiconductor chip having a bump on a surface thereof and a board on which the semiconductor chip is placed with the bump interposed therebetween;
a laser beam applying step of applying a laser beam to the semiconductor chip from an opposite surface of the semiconductor chip to reflow the bump included in an irradiation range of the workpiece;
a temperature information acquiring step of capturing an image of the irradiation range with use of a thermal camera while the laser beam is applied to the semiconductor chip, and acquiring temperature information regarding the semiconductor chip from a captured image;
a storing step of storing reference temperature information that represents temperature information obtained when the semiconductor chip and the board have been properly bonded to each other by the laser beam applied thereto; and
a determining step of determining whether or not the semiconductor chip and the board have been properly bonded to each other by the laser beam applied thereto, on a basis of the reference temperature information stored in the storing step and the temperature information acquired in the temperature information acquiring step.