US 12,474,126 B2
Heat dissipation device having irregular shape
Jen-Chih Cheng, New Taipei (TW)
Assigned to COOLER MASTER CO., LTD., New Taipei (TW)
Filed by COOLER MASTER CO., LTD., New Taipei (TW)
Filed on Jan. 31, 2024, as Appl. No. 18/429,199.
Application 18/429,199 is a division of application No. 16/711,233, filed on Dec. 11, 2019, granted, now 11,913,725.
Claims priority of provisional application 62/798,480, filed on Jan. 30, 2019.
Claims priority of provisional application 62/783,717, filed on Dec. 21, 2018.
Prior Publication US 2024/0219126 A1, Jul. 4, 2024
Int. Cl. F28D 15/00 (2006.01); F28D 15/04 (2006.01)
CPC F28D 15/043 (2013.01) 6 Claims
OG exemplary drawing
 
1. A heat dissipation device, comprising:
a first casing having a heat source receiving area on an outer surface of the first casing;
a second casing coupled to the first casing, the second casing including:
a body having an inner surface and an outer surface opposite the inner surface, a first portion, a second portion, and a third portion, each of the first and second portions having a same area, the third portion having an area that is larger than the areas of the first and second portions and the third portion located between the first and second portions, a projection of the heat source receiving area is disposed in the third portion; and
a plurality of columns on the inner surface; and
a first wick structure disposed on the inner surface and in at least two of the first, second, and third portions, wherein
the first wick structure is disposed in gaps between the plurality of columns and contacts the inner surface of the second casing, and
the first wick structure includes a first longitudinally extending portion and a second longitudinally extending portion, the first wick structure has a bend at a location where the first longitudinally extending portion and the second longitudinally extending portion connect, the bend is disposed in the third portion, and the second longitudinally extending portion extends towards and overlaps with the projection of the heat source receiving area.