| CPC C25D 11/18 (2013.01) [C23C 28/00 (2013.01); C25D 11/026 (2013.01)] | 19 Claims |

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1. A method of coating a semiconductor component substrate, the method comprising:
submerging the semiconductor component substrate in an alkaline electrolyte, wherein the alkaline electrolyte comprises yttrium;
igniting a plasma at a surface of the semiconductor component substrate for a period of time less than or about 12 hours; and
forming a yttrium-containing oxide on the semiconductor component substrate, wherein a surface of the yttrium-containing oxide is characterized by a yttrium incorporation of greater than or about 10 at. %, and wherein the yttrium-containing oxide formed by submerging the semiconductor component substrate in the alkaline electrolyte and igniting a plasma at a surface of the semiconductor component substrate comprises pores characterized by an average pore diameter of less than or about 100 nm.
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