US 12,473,472 B2
Photocurable adhesive
Kazuma Yamaguchi, Kariya (JP); Takao Izumi, Kariya (JP); Keisuke Ota, Kuki (JP); Kohei Hirayama, Kuki (JP); Shinsuke Yamada, Kuki (JP); and Ryo Ogawa, Kuki (JP)
Assigned to DENSO CORPORATION, Kariya (JP); and ADEKA CORPORATION, Tokyo (JP)
Filed by DENSO CORPORATION, Kariya (JP); and ADEKA CORPORATION, Tokyo (JP)
Filed on Mar. 7, 2022, as Appl. No. 17/687,728.
Claims priority of application No. 2021-036465 (JP), filed on Mar. 8, 2021.
Prior Publication US 2022/0282139 A1, Sep. 8, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. C09J 175/04 (2006.01); C08G 18/00 (2006.01); C09J 11/04 (2006.01)
CPC C09J 175/04 (2013.01) [C08G 18/003 (2013.01); C09J 11/04 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A photocurable adhesive formulated to be curable by laser light irradiation, comprising
an epoxy adhesive component; and
a light-absorbing component configured to generate heat by the laser light irradiation, wherein
the epoxy adhesive component contains a cyanate ester resin, an epoxy resin, a latent amine curing agent containing active hydrogen, and an ion scavenger, and
the ion scavenger has an ion exchange capacity of 1.0 meq/g or more.