US 12,473,470 B2
Photocurable adhesive
Kazuma Yamaguchi, Kariya (JP); Takao Izumi, Kariya (JP); Keisuke Ota, Kuki (JP); Kohei Hirayama, Kuki (JP); Shinsuke Yamada, Kuki (JP); and Ryo Ogawa, Kuki (JP)
Assigned to DENSO CORPORATION, Kariya (JP); and ADEKA CORPORATION, Tokyo (JP)
Filed by DENSO CORPORATION, Kariya (JP); and ADEKA CORPORATION, Tokyo (JP)
Filed on Mar. 7, 2022, as Appl. No. 17/687,733.
Claims priority of application No. 2021-036466 (JP), filed on Mar. 8, 2021.
Prior Publication US 2022/0282138 A1, Sep. 8, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. C09J 163/00 (2006.01); C09J 11/04 (2006.01); C09J 11/06 (2006.01)
CPC C09J 163/00 (2013.01) [C09J 11/04 (2013.01); C09J 11/06 (2013.01); C09J 2463/00 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A photocurable adhesive formulated to be curable by laser light irradiation, comprising
an epoxy adhesive component; and
titanium black in a content of 1 ppm by mass or more and 150 ppm by mass or less relative to 100 parts by mass of the epoxy adhesive component,
wherein the titanium black has a primary particle size of 5 nm or more and 150 nm or less.