US 12,473,458 B2
Sealing method
Kosuke Morita, Ibaraki (JP)
Assigned to NITTO DENKO CORPORATION, Ibaraki (JP)
Appl. No. 17/789,081
Filed by NITTO DENKO CORPORATION, Ibaraki (JP)
PCT Filed Dec. 24, 2020, PCT No. PCT/JP2020/048504
§ 371(c)(1), (2) Date Jun. 24, 2022,
PCT Pub. No. WO2021/132485, PCT Pub. Date Jul. 1, 2021.
Claims priority of application No. 2019-235155 (JP), filed on Dec. 25, 2019.
Prior Publication US 2023/0037303 A1, Feb. 9, 2023
Int. Cl. C09J 7/10 (2018.01); C09J 5/00 (2006.01); C09J 7/38 (2018.01)
CPC C09J 7/10 (2018.01) [C09J 5/00 (2013.01); C09J 7/38 (2018.01); C09J 2301/416 (2020.08); C09J 2481/00 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A sealing method comprising the following steps in order:
a step of obtaining a photo-curable sealant sheet,
a step of subjecting the sealant sheet to photoirradiation, and
a step of applying the sealant sheet to a target object, and
wherein the sealant sheet comprises an epoxy group-containing polysulfide polymer (AB) having two or more epoxy groups per molecule, a thiol compound (C) having two or more thiol groups per molecule, and a photobase generator (D).