US 12,473,196 B2
MEMS chip, manufacturing method thereof, MEMS device, and electronic device
Fengpei Sun, Shenzhen (CN); Zhihong Feng, Wuhan (CN); Jinghui Xu, Shenzhen (CN); and Xiaoshi Dong, Shenzhen (CN)
Assigned to HUAWEI TECHNOLOGIES CO., LTD., Shenzhen (CN)
Filed by HUAWEI TECHNOLOGIES CO., LTD., Guangdong (CN)
Filed on Jan. 30, 2023, as Appl. No. 18/161,263.
Application 18/161,263 is a continuation of application No. PCT/CN2021/108531, filed on Jul. 27, 2021.
Claims priority of application No. 202010762037.3 (CN), filed on Jul. 31, 2020; and application No. 202011436611.2 (CN), filed on Dec. 11, 2020.
Prior Publication US 2023/0174370 A1, Jun. 8, 2023
Int. Cl. B81B 3/00 (2006.01); B81C 1/00 (2006.01); G02B 26/08 (2006.01)
CPC B81B 3/0051 (2013.01) [B81B 3/001 (2013.01); B81C 1/00341 (2013.01); G02B 26/0841 (2013.01); G02B 26/085 (2013.01); G02B 26/0858 (2013.01); B81B 2201/042 (2013.01); B81B 2203/0136 (2013.01); B81C 2203/03 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A micro-electro-mechanical systems (MEMS) chip, comprising:
a substrate;
a movable assembly;
a fastening assembly; and
a drive assembly, wherein the fastening assembly is located between the substrate and the movable assembly;
wherein the movable assembly comprises a fastening portion, a movable portion, and a first support beam, wherein the first support beam is connected to the movable portion and the fastening portion, and wherein a first avoidance slot is disposed in a first face that is of the movable portion and that faces the fastening assembly;
wherein a boss and a first position limiting pole are disposed on a face that is of the fastening assembly and that faces the movable assembly, wherein the boss is connected to the fastening portion and is configured to support the fastening portion, and wherein the first position limiting pole corresponds to the first avoidance slot; and
wherein the drive assembly is connected to the movable portion, and is configured to drive the movable portion to move.