US 12,472,738 B2
Semiconductor chip delamination apparatus device
Jae Won Cho, Cheongju-si (KR)
Assigned to DOOSAN TESNA INC., Pyeongtaek-si (KR)
Appl. No. 17/916,989
Filed by ENGION CO., LTD., Cheongju-si (KR)
PCT Filed May 20, 2021, PCT No. PCT/KR2021/006270
§ 371(c)(1), (2) Date Oct. 4, 2022,
PCT Pub. No. WO2022/039349, PCT Pub. Date Feb. 24, 2022.
Claims priority of application No. 10-2020-0103081 (KR), filed on Aug. 18, 2020.
Prior Publication US 2023/0158790 A1, May 25, 2023
Int. Cl. B32B 43/00 (2006.01); H01L 21/67 (2006.01)
CPC B32B 43/006 (2013.01) [H01L 21/67017 (2013.01); H01L 21/67253 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A semiconductor chip delamination device for peeling off a protective film attached to one surface of a semiconductor chip, comprising:
a stage unit (400) configured to allow a ring frame, in which the semiconductor chip having the protective film attached thereto is disposed, to be seated thereon;
a delamination feeding unit (300) configured to feed a delamination seal contactable with the protective film so as to peel off the protective film from the semiconductor chip;
a tension sensor (51) configured to detect a tension applied to the delamination seal;
a covering unit (500, 600) configured to allow the delamination seal to cover the semiconductor chip such that the delamination seal comes into close contact with the protective film;
a delaminating unit (700) configured to peel off, from the semiconductor chip, the delamination seal disposed to cover the semiconductor chip having the protective film disposed on one surface thereof;
a control signal generator (20) configured to apply a control signal to the stage unit (400), the delamination feeding unit (300), the covering unit (500, 600), and the delaminating unit (700) based on a sensing signal from a sensing unit (50) and preset data stored in a storage unit; and
a fluid delamination unit (1000) disposed on an outer side of the delaminating unit (700) and configured to discharge and spray a delamination actuating fluid for peeling off at least the protective film disposed on one surface of the semiconductor chip from the semiconductor chip;
wherein the covering unit (500, 600) includes a pre-laminating pressing part (510) configured to press the delamination seal to cause the delamination seal to come into close contact with the protective film;
wherein the fluid delamination unit (1000) comprises:
a fluid delamination nozzle unit (1100) disposed on the outer side of the delaminating unit (700), and configured to be supplied with the delamination actuating fluid for peeling off at least the protective film disposed on one surface of the semiconductor chip from the semiconductor chip to directly discharge and spray the delamination actuating fluid; and
a fluid delamination discharge unit (1700) configured to filter the peeled protective film and discharge the delamination actuating fluid;
wherein the fluid delamination unit (1000) comprises a delamination fluid discharge regulator (1200) configured to regulate a discharge state of the delamination actuating fluid at the delamination nozzle unit (1100);
wherein the control signal generator (20) applies a driving control signal to the delamination fluid discharge regulator (1200) to control a discharge position of the fluid delamination nozzle unit (1100) so as to minimize the tension detected by the tension sensor (51) based on tension data detected by the tension sensor (51);
wherein the fluid delamination nozzle unit (1100) comprises:
a fluid delamination nozzle (1110) disposed on the outer side of the delaminating unit (700), and configured to be supplied with the delamination actuating fluid for peeling off at least the protective film disposed on one surface of the semiconductor chip from the semiconductor chip to directly discharge and spray the delamination actuating fluid;
wherein in order to peel off at least the protective film disposed on one surface of the semiconductor chip from the semiconductor chip, the delamination fluid discharge regulator (1200) comprises:
a delamination fluid nozzle discharge angle adjuster (1210) configured to move the fluid delamination nozzle (1110) to adjust a discharge angle of the delamination actuating fluid being discharged;
a fluid delamination vertical driving unit (1220) configured to adjust a vertical position of the fluid delamination nozzle (1110); and
a delamination fluid nozzle horizontal position adjuster (1230) configured to adjust a horizontal position of the fluid delamination nozzle (1110).