US 12,472,732 B2
Laminate, method for manufacturing laminate, and method for manufacturing flexible electronic device
Naoki Watanabe, Otsu (JP); Harumi Yonemushi, Otsu (JP); Kousuke Sasai, Otsu (JP); and Hiroyuki Wakui, Otsu (JP)
Assigned to TOYOBO CO., LTD., Osaka (JP)
Appl. No. 17/633,482
Filed by TOYOBO CO., LTD., Osaka (JP)
PCT Filed Sep. 30, 2020, PCT No. PCT/JP2020/037342
§ 371(c)(1), (2) Date Feb. 7, 2022,
PCT Pub. No. WO2021/070719, PCT Pub. Date Apr. 15, 2021.
Claims priority of application No. 2019-185261 (JP), filed on Oct. 8, 2019.
Prior Publication US 2022/0282052 A1, Sep. 8, 2022
Int. Cl. B32B 27/28 (2006.01); B32B 7/06 (2019.01); B32B 17/10 (2006.01)
CPC B32B 27/281 (2013.01) [B32B 7/06 (2013.01); B32B 17/10 (2013.01); B32B 2307/412 (2013.01); B32B 2457/14 (2013.01)] 8 Claims
 
1. A laminate comprising:
an inorganic substrate;
a silane coupling agent layer; and
a polyimide film of which a yellow index is 10 or less, a light transmittance at a wavelength of 400 nm is 70% or more, a tensile elasticity in both a MD direction and a TD direction is 3 GPa or more, and CTE in both a MD direction and a TD direction is −5 ppm/° C. to +55 ppm/° C.
in this order such that the polyimide film is bonded to a surface of the inorganic substrate with the silane coupling agent layer therebetween,
wherein an initial adhesive strength by a 90-degree peeling method when the polyimide film is peeled off from the laminate is 0.06 N/cm or more and 0.25 N/cm or less over the entire surface of the inorganic substrate to which the polyimide film is bonded.