| CPC B29C 71/0009 (2013.01) [B29C 64/188 (2017.08); B33Y 40/20 (2020.01); F26B 21/145 (2013.01); B29C 2037/90 (2013.01); B29C 2791/006 (2013.01)] | 18 Claims |

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1. A method comprising:
placing a part within a chamber;
providing vaporized solvent within the chamber such that the solvent condenses onto the part and treats the part via chemical-mechanical polishing (CMP);
applying a vacuum to the chamber to extract the solvent and stop treatment of the part via the CMP; and
controlling reduction of pressure within the chamber over time to apply the vacuum, according to a predefined time-pressure profile, to at least reduce defects in the part occurring due to the extraction of solvent from the part during application of the vacuum that stops the CMP.
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