US 12,472,602 B2
Textured CMP pad comprising polymer particles
Rui Ma, Aurora, IL (US); Kaiting Li, Portland, OR (US); Jessica Tabert, Aurora, IL (US); Sangcheol Kim, Chicago, IL (US); and Satish Rai, Aurora, IL (US)
Assigned to CMC MATERIALS LLC, Aurora, IL (US)
Filed by CMC Materials, Inc., Aurora, IL (US)
Filed on Sep. 2, 2022, as Appl. No. 17/902,210.
Claims priority of provisional application 63/240,103, filed on Sep. 2, 2021.
Prior Publication US 2023/0076804 A1, Mar. 9, 2023
Int. Cl. B24B 37/24 (2012.01); C08L 75/04 (2006.01)
CPC B24B 37/24 (2013.01) [C08L 75/04 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A chemical mechanical polishing pad comprising a polishing portion, the polishing portion comprising:
a polymeric body having a polishing surface;
a plurality of solid, rigid polymer particles embedded within the body of the polymeric body, wherein at least a portion of the plurality of polymer particles is at least partially exposed at the polishing surface of the polymeric body, the exposed portion of the polymer particles protruding from the polishing surface of the polymeric body; and
a plurality of pores at the polishing surface of the polymeric body,
wherein an average surface roughness (Sa) of the polishing surface of the ranges from 5.32 μm to 8.02 μm.