US 12,472,582 B2
Laser processing apparatus and debris remover
Yusuke Mizunaga, Tokyo (JP)
Assigned to DISCO CORPORATION, Tokyo (JP)
Filed by DISCO CORPORATION, Tokyo (JP)
Filed on Dec. 5, 2022, as Appl. No. 18/061,548.
Claims priority of application No. 2021-198536 (JP), filed on Dec. 7, 2021.
Prior Publication US 2023/0173611 A1, Jun. 8, 2023
Int. Cl. B23K 26/14 (2014.01); B23K 26/06 (2014.01); B23K 26/142 (2014.01)
CPC B23K 26/142 (2015.10) [B23K 26/0665 (2013.01); B23K 26/1462 (2015.10)] 6 Claims
OG exemplary drawing
 
1. A laser processing apparatus comprising:
a chuck table having a holding surface to hold a workpiece thereon; and
a laser irradiation unit that irradiates the workpiece held on the chuck table with a laser beam to process the workpiece,
wherein the laser irradiation unit includes
a laser oscillator that emits a laser beam,
a condenser that focuses the laser beam emitted by the laser oscillator and irradiates the workpiece held on the chuck table with the focused laser beam, and
a debris remover that is disposed adjacent to the condenser and sucks and removes debris generated through the irradiation with the laser beam, and
the debris remover includes
an air nozzle that blows air from one side toward a processing point at which the workpiece is irradiated with the laser beam,
a suction duct having a suction opening for sucking debris that has scattered to another side due to the air blown from the air nozzle,
vortex generators formed on a processing point side of the suction opening for guiding the scattering debris into the suction duct, and
a C-shaped sealing plate that is formed in such a manner as to surround the vortex generators from a rear side and reduces a space defined between the suction opening and the workpiece.