US 12,472,581 B2
Method of processing a substrate and system for processing a substrate
Karl Heinz Priewasser, Munich (DE); and Naoko Yamamoto, Tokyo (JP)
Assigned to DISCO CORPORATION, Tokyo (JP)
Filed by DISCO CORPORATION, Tokyo (JP)
Filed on Apr. 12, 2022, as Appl. No. 17/658,926.
Claims priority of application No. 10 2021 203 911.1 (DE), filed on Apr. 20, 2021.
Prior Publication US 2022/0331899 A1, Oct. 20, 2022
Int. Cl. B23K 26/03 (2006.01); B23K 26/00 (2014.01); B23K 26/38 (2014.01); B23K 101/40 (2006.01)
CPC B23K 26/032 (2013.01) [B23K 26/009 (2013.01); B23K 26/38 (2013.01); B23K 2101/40 (2018.08)] 20 Claims
OG exemplary drawing
 
1. A method of processing a substrate, the substrate having a first side and a second side being opposite to the first side, wherein the method comprises:
attaching a protective film to the first side of the substrate;
after attaching the protective film to the first side of the substrate, processing the substrate from the second side of the substrate;
after processing the substrate from the second side of the substrate, inspecting the second side of the substrate for defects from the second side of the substrate;
after inspecting the second side of the substrate for defects, attaching a support film to the second side of the substrate;
removing the protective film from the first side of the substrate; and
after removing the protective film from the first side of the substrate, inspecting the first side of the substrate for defects from the first side of the substrate.