US 12,472,534 B2
Substrate processing apparatus
Kensuke Demura, Kanagawa (JP); Satoshi Nakamura, Kanagawa (JP); Masaya Kamiya, Kanagawa (JP); and Minami Nakamura, Kanagawa (JP)
Assigned to SHIBAURA MECHATRONICS CORPORATION, Kanagawa (JP)
Filed by SHIBAURA MECHATRONICS CORPORATION, Kanagawa (JP)
Filed on Feb. 27, 2023, as Appl. No. 18/114,377.
Claims priority of application No. 2022-029357 (JP), filed on Feb. 28, 2022; and application No. 2023-008307 (JP), filed on Jan. 23, 2023.
Prior Publication US 2023/0271231 A1, Aug. 31, 2023
Int. Cl. B08B 7/00 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01)
CPC B08B 7/0092 (2013.01) [B08B 7/0014 (2013.01); H01L 21/67051 (2013.01); H01L 21/67109 (2013.01); H01L 21/68735 (2013.01); H01L 21/68757 (2013.01); H01L 21/68785 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A substrate processing apparatus comprising:
a stage configured to rotate around a central axis;
a plurality of holders provided on the stage and configured to hold a substrate;
a cooler configured to supply a cooling gas to a space between the stage and the substrate; and
a liquid supply configured to supply a liquid to a surface of the substrate on an opposite side to the stage,
wherein, when holding the substrate, the plurality of holders moves toward the central axis of the stage along a surface of the stage to surround a peripheral edge of the substrate in its entirety, thereby closing the space between the stage and the substrate.