US 12,144,150 B2
Heat dissipating device
Xiao-Yao Li, Hui Zhou (CN); Yu-Ka Feng, Hui Zhou (CN); and Yuan-Long Wen, Hui Zhou (CN)
Assigned to VAST GLORY ELECTRONIC & HARDWARE & PLASTIC (HUI ZHOU) LTD, Hui Zhou (CN)
Filed by VAST GLORY ELECTRONIC & HARDWARE & PLASTIC (HUI ZHOU) LTD, Hui Zhou (CN)
Filed on Oct. 27, 2022, as Appl. No. 17/975,511.
Claims priority of application No. 202210921448.1 (CN), filed on Aug. 2, 2022.
Prior Publication US 2024/0049428 A1, Feb. 8, 2024
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20309 (2013.01) [H05K 7/20327 (2013.01); H05K 7/20381 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A heat dissipating device comprising:
a thermal board having
a heat-absorbing edge; and
a condensation edge;
a cycling channel being a passage annularly formed in the thermal board, configured to be filled with a working fluid, and having
at least one passive one-way valve section; each of the at least one passive one-way valve section being adjacent to the heat-absorbing edge; the working fluid absorbing heat to cause phase changing on part of the working fluid to flow in a single direction in the cycling channel through each of the at least one passive one-way valve section; and
a thermal base having
at least one assembling groove formed inwardly; each of the at least one assembling groove being configured to install the thermal board;
wherein the thermal board has
an assembling rib protruding from the heat-absorbing edge and mounted in the at least one assembling groove.