US 12,144,148 B2
Pressure based phase immersion cooling system
Vaidehi Oruganti, Kirkland, WA (US); Christian L. Belady, Mercer Island, WA (US); Husam Alissa, Redmond, WA (US); Bharath Ramakrishnan, Bellevue, WA (US); and Ruslan Nagimov, Redmond, WA (US)
Assigned to Microsoft Technology Licensing, LLC, Redmond, WA (US)
Filed by Microsoft Technology Licensing, LLC, Redmond, WA (US)
Filed on Jun. 14, 2022, as Appl. No. 17/840,338.
Prior Publication US 2023/0403821 A1, Dec. 14, 2023
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/203 (2013.01) [H05K 7/20809 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A pressurized cooling system for cooling one or more electronic heat generating components using dielectric heat transfer fluid disposed within a two-phase immersion cooling container, said pressurized cooling system comprising:
the two-phase immersion cooling container operable to maintain different pressure levels; and
a pressure system structured to modify a pressure within the two-phase immersion cooling container, a low-temperature boiling point of the dielectric heat transfer fluid changes when the pressure within the two-phase immersion cooling container changes, thereby enabling use of different cooling rates to cool the one or more heat generating components,
wherein:
the pressurized cooling system operates in a first state when the pressure of the two-phase immersion cooling container is above a threshold pressure,
the pressurized cooling system operates in a second state when the pressure of the two-phase immersion cooling container is at the threshold pressure,
the pressurized cooling system operates in either one of the first state or the second state based on an operating state of the one or more heat generating components, and
the pressure system modifies the pressure within the two-phase immersion cooling container based on a load imparted on the one or more heat generating components.