US 12,144,110 B2
Reduced vertical profile ejector for liquid cooled modules
Guixiang Tan, Portland, OR (US); Xiang Li, Portland, OR (US); Casey Winkel, Hillsboro, OR (US); and George Vergis, Portland, OR (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Dec. 24, 2020, as Appl. No. 17/134,028.
Prior Publication US 2021/0120670 A1, Apr. 22, 2021
Int. Cl. H05K 1/11 (2006.01); H05K 5/00 (2006.01); H05K 5/02 (2006.01); H05K 7/20 (2006.01)
CPC H05K 1/11 (2013.01) [H05K 5/0026 (2013.01); H05K 5/0295 (2013.01); H05K 7/20218 (2013.01)] 9 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a printed circuit board (PCB) dual in-line memory module (DIMM) connector having ejectors, the ejectors having a small enough vertical profile to permit unbent liquid cooling conduits to run across the DIMM's semiconductor chips.