US 12,144,107 B2
Substrate connection structure and vehicle wiring module
Nobuyuki Matsumura, Mie (JP); Shinichi Takase, Mie (JP); Hiroki Shimoda, Mie (JP); and Taiji Yanagida, Mie (JP)
Assigned to AUTONETWORKS TECHNOLOGIES, LTD., Mie (JP); SUMITOMO WIRING SYSTEMS, LTD., Mie (JP); and SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
Appl. No. 17/928,157
Filed by AUTONETWORKS TECHNOLOGIES, LTD., Mie (JP); SUMITOMO WIRING SYSTEMS, LTD., Mie (JP); and SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
PCT Filed May 28, 2021, PCT No. PCT/JP2021/020350
§ 371(c)(1), (2) Date Nov. 28, 2022,
PCT Pub. No. WO2021/251170, PCT Pub. Date Dec. 16, 2021.
Claims priority of application No. 2020-102106 (JP), filed on Jun. 12, 2020.
Prior Publication US 2023/0247760 A1, Aug. 3, 2023
Int. Cl. H05K 1/02 (2006.01); B60R 16/02 (2006.01); H05K 1/14 (2006.01)
CPC H05K 1/0277 (2013.01) [B60R 16/0215 (2013.01); H05K 1/14 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A substrate connection structure comprising:
at least one flexible substrate that includes a first conductive path and has flexibility;
a circuit board including a second conductive path that is electrically connected to the first conductive path, wherein the flexible substrate includes a main body portion, a circuit connecting portion that extends from the main body portion and is overlaid on the circuit board; and
an adhesive layer having adhesiveness and interposed between the circuit connecting portion and the circuit board,
wherein the first conductive path includes a first land included in the circuit connecting portion,
the second conductive path includes a second land that is connected to the first land,
a connected portion between the first land and the second land is covered by a covering portion that is constituted by a resin having an insulating property,
the circuit connecting portion includes:
a stacked portion that is overlaid on the circuit board;
a base end portion that is an intermediate portion between the stacked portion and a boundary position between the circuit connecting portion and the main body portion; and
a bent portion that is bent at a boundary position between the base end portion and the stacked portion, and
the adhesive layer is provided between the stacked portion and the circuit board and is adjacent to the bent portion, and an intermediate portion of the stacked portion between the bent portion and the first land is bonded to the circuit board via the adhesive layer.