US 12,144,103 B2
Printed circuit board and camera device comprising same
Do Hyuk Yoo, Seoul (KR); Hee Jung Lee, Seoul (KR); Young Ju Han, Seoul (KR); and Young Il Lee, Seoul (KR)
Assigned to LG INNOTEK CO., LTD., Seoul (KR)
Appl. No. 17/252,172
Filed by LG INNOTEK CO., LTD., Seoul (KR)
PCT Filed Jun. 14, 2019, PCT No. PCT/KR2019/007212
§ 371(c)(1), (2) Date Dec. 14, 2020,
PCT Pub. No. WO2019/240538, PCT Pub. Date Dec. 19, 2019.
Claims priority of application No. 10-2018-0069233 (KR), filed on Jun. 15, 2018; application No. 10-2018-0073446 (KR), filed on Jun. 26, 2018; and application No. 10-2018-0095130 (KR), filed on Aug. 14, 2018.
Prior Publication US 2021/0267043 A1, Aug. 26, 2021
Int. Cl. H01S 5/024 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01)
CPC H05K 1/0206 (2013.01) [H01S 5/02469 (2013.01); H05K 1/112 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A circuit board comprising:
a substrate;
a heat dissipation via passing through at least a portion of the substrate;
a through via passing through a portion of the substrate and spaced apart from the heat dissipation via in a horizontal direction;
a pad disposed on the substrate and overlapping with the heat dissipation via in a vertical direction and not overlapping with the through via in the vertical direction;
a first connection part disposed on the pad;
a first element mounted on the first connection part,
a second connection part disposed on the pad and spaced apart from the first connection part in the horizontal direction; and
a second element mounted on the second connection part,
wherein the first element includes a first region overlapping the pad in the vertical direction and a second region non-overlapping with the pad in the vertical direction,
wherein a part of the second region of the first element overlaps the through via in the vertical direction,
wherein the pad includes an overlap region overlapping the heat dissipation via in the vertical direction and a non-overlapping region not overlapping with the heat dissipation via in the vertical direction, and
wherein the first and second connection parts are disposed on the non-overlapping region of the pad.