US 12,144,090 B2
Monolithic modular microwave source with integrated temperature control
James Carducci, Sunnyvale, CA (US); Richard C. Fovell, San Jose, CA (US); Larry D. Elizaga, Tracy, CA (US); Silverst Rodrigues, Bangalore (IN); Thai Cheng Chua, Cupertino, CA (US); and Philip Allan Kraus, San Jose, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Dec. 15, 2022, as Appl. No. 18/082,452.
Application 18/082,452 is a continuation of application No. 16/586,548, filed on Sep. 27, 2019, granted, now 11,564,292.
Prior Publication US 2023/0135935 A1, May 4, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H05B 6/64 (2006.01); H05B 6/80 (2006.01)
CPC H05B 6/645 (2013.01) [H05B 6/6402 (2013.01); H05B 6/806 (2013.01); H05B 2206/04 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A housing, comprising:
a thermally conductive body with a first surface and a second surface opposite from the first surface;
a plurality of openings through a thickness of the thermally conductive body between the first surface and the second surface;
a channel into the first surface of the thermally conductive body;
a cover over the channel;
a first stem over the cover and extending away from the first surface, wherein the first stem opens into the channel, wherein the first stem is at an end of the cover; and
a second stem over the cover and extending away from the first surface, wherein the second stem opens into the channel.