US 12,144,089 B2
Induction heating type cooktop with reduced thermal deformation of thin film
Seongjun Kim, Seoul (KR); Wontae Kim, Seoul (KR); and Seonghoon Hwang, Seoul (KR)
Assigned to LG Electronics Inc., Seoul (KR)
Filed by LG Electronics Inc., Seoul (KR)
Filed on May 15, 2023, as Appl. No. 18/197,446.
Application 18/197,446 is a continuation of application No. 16/849,558, filed on Apr. 15, 2020, granted, now 11,678,411.
Claims priority of application No. 10-2019-0169894 (KR), filed on Dec. 18, 2019.
Prior Publication US 2023/0284350 A1, Sep. 7, 2023
Int. Cl. H05B 6/12 (2006.01); C03C 17/36 (2006.01); H05B 3/74 (2006.01); H05B 6/06 (2006.01)
CPC H05B 6/1272 (2013.01) [C03C 17/3655 (2013.01); H05B 3/74 (2013.01); H05B 6/062 (2013.01); H05B 6/1254 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An induction heating cooktop, comprising:
a cover plate coupled to a top of a case, the cover plate comprising an upper plate configured to seat an object to be heated;
a working coil disposed inside the case and configured to heat the object; and
a thin film having a thickness that enables the thin film (i) to transmit a magnetic field generated by the working coil to the object and (ii) to be inductively heated by the working coil to thereby heat the object, the thin film comprising a plurality of sub-films that are arranged about a central portion of the thin film,
wherein an outer boundary of one of the plurality of sub-films is positioned on a radially different position from an outer boundary of another of the plurality of sub-films relative to the central portion of the thin film.