US 12,144,068 B2
Heater having flexible printed wiring board and method for manufacturing same
Garo Miyamoto, Tokyo (JP); and Shunsuke Aoyama, Tokyo (JP)
Assigned to NIPPON MEKTRON, LTD., Tokyo (JP)
Filed by NIPPON MEKTRON, LTD., Tokyo (JP)
Filed on Feb. 23, 2021, as Appl. No. 17/182,351.
Claims priority of application No. 2020-056364 (JP), filed on Mar. 26, 2020.
Prior Publication US 2021/0307118 A1, Sep. 30, 2021
Int. Cl. H05B 3/34 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01)
CPC H05B 3/34 (2013.01) [H05K 1/0212 (2013.01); H05K 1/189 (2013.01); H05B 2203/013 (2013.01); H05B 2203/017 (2013.01); H05K 2201/0355 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A method for manufacturing a heater having a flexible printed wiring board, comprising an etching step and a laminating step in this order, wherein
the etching step comprises: etching a first metal foil positioned on a first surface of a base film and a second metal foil positioned on a second surface of the base film; forming a heater circuit portion that generates heat when energized, by a part of the first metal foil; and forming a heat conductive foil portion that maintains a non-energized state, by a part of the second metal foil, wherein the heater circuit portion and the heat conductive foil portion are formed at the same time, and
the laminating step comprises providing a first cover film that covers a surface of the first metal foil and a second cover film that covers a surface of the second metal foil.