US 12,143,762 B2
Earphone with solid body
Valivann Seangly, Portland, OR (US); Ben Loeliger, Portland, OR (US); Kenneth Ball, Portland, OR (US); and Caleb Rosenau, Portland, OR (US)
Assigned to AUDIOLINEOUT LLC, Portland, OR (US)
Filed by Audiolineout LLC, Portland, OR (US)
Filed on May 17, 2023, as Appl. No. 18/198,757.
Application 18/198,757 is a continuation of application No. 17/361,815, filed on Jun. 29, 2021, granted, now 11,659,312.
Application 17/361,815 is a continuation of application No. 16/532,316, filed on Aug. 5, 2019, abandoned.
Prior Publication US 2023/0292028 A1, Sep. 14, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H04R 1/10 (2006.01); G06F 30/10 (2020.01); H04R 31/00 (2006.01)
CPC H04R 1/1016 (2013.01) [G06F 30/10 (2020.01); H04R 31/00 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An earphone comprising:
a solid earphone body;
a pressure relief vent formed in the solid earphone body;
a cap, the cap configured to mate with the solid earphone body; and
a vent bore formed in the cap and opening to an exterior surface of the cap, the vent bore configured to fluidly mate with the pressure relief vent of the solid earphone body when the cap is mated to the solid earphone body;
wherein the earphone comprises less than about 25% of unfilled space compared with a total volume of the solid earphone body, and the solid earphone body defines an opening to provide access to negative spaces formed in the solid earphone body, the opening being less than about 25% of a total surface area of the solid earphone body.
 
18. An earphone comprising:
a solid earphone body;
a pressure relief vent formed in the solid earphone body;
a cap, the cap configured to mate with the solid earphone body;
a vent bore formed in the cap and opening to an exterior surface of the cap, the vent bore configured to fluidly mate with the pressure relief vent of the solid earphone body when the cap is mated to the solid earphone body;
a sound bore formed as a negative space in the solid earphone body; and
a sound chamber formed as a negative space with the solid earphone body and fluidly connected to the sound bore;
wherein the earphone comprises less than about 25% of unfilled space compared with a total volume of the solid earphone body.
 
20. An earphone comprising:
a solid earphone body;
a cap, the cap configured to mate with the solid earphone body;
a sound bore formed as a negative space in the solid earphone body and having a variable diameter; and
a sound chamber formed as a negative space with the solid earphone body, fluidly connected to the sound bore, and having a diameter larger than a largest diameter of the sound bore;
wherein the earphone comprises less than about 25% of unfilled space compared with a total volume of the solid earphone body, and the solid earphone body defines an opening to provide access to negative spaces formed in the solid earphone body, the opening being less than about 25% of a total surface area of the solid earphone body.