| CPC H02M 7/003 (2013.01) [H05K 7/209 (2013.01)] | 10 Claims |
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1. A power conversion device comprising:
a semiconductor power module including a module body portion storing a semiconductor element, and a module busbar protruding from the module body portion;
a capacitor module including a capacitor element, a capacitor case formed in a bottomed tubular shape and storing the capacitor element with sealing resin interposed therebetween, and a capacitor busbar having one end electrically connected to the capacitor element and another end extending outward from the capacitor case and electrically connected to the module busbar; and
a power conversion device case formed in a bottomed tubular shape and storing the semiconductor power module and the capacitor module, wherein
an outer surface of a bottom wall of the capacitor case and an inner surface of a bottom wall of the power conversion device case are thermally connected to each other,
the capacitor module has a heat dissipation member located toward an opening side of the capacitor case relative to the capacitor element and thermally connected to the sealing resin,
the capacitor element is located between the heat dissipation member and the bottom wall of the power conversion device case,
as the capacitor busbar, a first capacitor busbar and a second capacitor busbar are provided,
the capacitor element has a first electrode connected to the first capacitor busbar and a second electrode connected to the second capacitor busbar,
one of the first electrode and the second electrode is located on a side of the capacitor element toward the bottom wall of the power conversion device case, and
another of the first electrode and the second electrode is located on a side of the capacitor element toward the heat dissipation member.
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