US 12,142,891 B2
Surface emitting laser package
Myung Sub Kim, Seoul (KR); Woo Jin Moon, Seoul (KR); and Ju Young Park, Seoul (KR)
Assigned to SUZHOU LEKIN SEMICONDUCTOR CO., LTD., Suzhou (CN)
Appl. No. 17/041,067
Filed by SUZHOU LEKIN SEMICONDUCTOR CO., LTD., Taicang (CN)
PCT Filed May 2, 2019, PCT No. PCT/KR2019/005264
§ 371(c)(1), (2) Date Sep. 24, 2020,
PCT Pub. No. WO2019/216596, PCT Pub. Date Nov. 14, 2019.
Claims priority of application No. 10-2018-0053022 (KR), filed on May 9, 2018; application No. 10-2018-0089669 (KR), filed on Aug. 1, 2018; and application No. 10-2018-0099462 (KR), filed on Aug. 24, 2018.
Prior Publication US 2021/0098964 A1, Apr. 1, 2021
Int. Cl. H01S 5/022 (2021.01); H01S 5/02257 (2021.01); H01S 5/02325 (2021.01); H01S 5/02345 (2021.01); H01S 5/042 (2006.01); H01S 5/18 (2021.01); H01S 5/183 (2006.01); H01S 5/42 (2006.01)
CPC H01S 5/02345 (2021.01) [H01S 5/022 (2013.01); H01S 5/02257 (2021.01); H01S 5/02325 (2021.01); H01S 5/04252 (2019.08); H01S 5/18 (2013.01); H01S 5/183 (2013.01); H01S 5/423 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A surface emitting laser package comprising:
a housing including a seating portion, the seating portion having a first pattern;
a surface emitting laser element disposed in the housing; and
a diffusion part disposed on the seating portion of the housing, and having a second pattern having a shape corresponding to a shape of the first pattern,
wherein the first pattern and the second pattern include a plurality of threads.