| CPC H01Q 9/0407 (2013.01) [H01Q 1/2283 (2013.01)] | 18 Claims |

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1. An antenna package, comprising:
a printed circuit board comprising a rear conductive layer disposed at the upper portion;
a rear antenna unit disposed at an upper portion of the printed circuit board, wherein the rear antenna unit is directly mounted on the printed circuit board or integrated with the printed circuit board;
a front antenna unit disposed toward a bottom side of the printed circuit board and electrically connected to the printed circuit board; and
a driving integrated circuit chip mounted on the rear conductive layer,
wherein the front antenna unit is disposed on a front dielectric layer which is different from the printed circuit board,
the rear conductive layer comprises the rear antenna unit, and a connection pad on which the driving integrated circuit chip is mounted, and
the front antenna unit and the rear antenna unit are each electrically connected to a lead branching from the connection pad.
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