US 12,142,811 B2
Antenna device
Kyo Sung Ji, Hwaseong-si (KR); Hye Yeon Kim, Hwaseong-si (KR); and Youn Jun Cho, Hwaseong-si (KR)
Assigned to KMW INC., Hwaseong-si (KR)
Filed by KMW INC., Hwaseong-si (KR)
Filed on Mar. 11, 2022, as Appl. No. 17/693,259.
Application 17/693,259 is a continuation of application No. PCT/KR2020/012602, filed on Sep. 18, 2020.
Claims priority of application No. 10-2019-0115590 (KR), filed on Sep. 19, 2019; and application No. 10-2020-0120021 (KR), filed on Sep. 17, 2020.
Prior Publication US 2022/0200125 A1, Jun. 23, 2022
Int. Cl. H01Q 1/02 (2006.01); F28D 15/02 (2006.01); F28F 3/12 (2006.01); H01Q 1/22 (2006.01); F28D 21/00 (2006.01)
CPC H01Q 1/02 (2013.01) [F28D 15/0233 (2013.01); F28F 3/12 (2013.01); H01Q 1/2283 (2013.01); F28D 2021/0029 (2013.01)] 9 Claims
OG exemplary drawing
 
1. An antenna device comprising:
a main housing configured to house and fix a first board having a plurality of heaters mounted on a rear surface thereof;
at least one U-shaped heat dissipation cluster detachably coupled to the rear surface of the main housing, and filled with a predetermined refrigerant, wherein the refrigerant receives heat from the heaters and dissipates the heat to the outside while moving along a pattern flow path formed in a distributed manner toward the outside; and
at least one heat-collection mediating fixing part configured to collect heat from the heaters and transfer the collected heat to the U-shaped heat dissipation cluster, while mediating the attachment/detachment of the U-shaped heat dissipation cluster to/from the rear surface of the main housing,
wherein the U-shaped heat dissipation cluster comprises:
a lower heat dissipation part provided at the bottom of the rear surface of the main housing; and
an upper heat dissipation part provided at the top of the rear surface of the main housing, and
the antenna device further comprises an intermediate heat dissipation cluster configured to dissipate heat generated from a plurality of first heaters mounted on a region of the rear surface of the first board, the region corresponding to the space between the lower heat dissipation part and the upper heat dissipation part.