US 12,142,808 B2
Wilkinson divider
Mikko Varonen, Espoo (FI); and Antti Lamminen, Espoo (FI)
Assigned to TEKNOLOGIAN TUTKIMUSKESKUS VTT OY, Espoo (FI)
Appl. No. 17/440,523
Filed by TEKNOLOGIAN TUTKIMUSKESKUS VTT OY, Espoo (FI)
PCT Filed Mar. 17, 2020, PCT No. PCT/FI2020/050165
§ 371(c)(1), (2) Date Sep. 17, 2021,
PCT Pub. No. WO2020/188146, PCT Pub. Date Sep. 24, 2020.
Claims priority of application No. 20195200 (FI), filed on Mar. 18, 2019.
Prior Publication US 2022/0166122 A1, May 26, 2022
Int. Cl. H01P 5/16 (2006.01); H01L 23/66 (2006.01); H01Q 21/00 (2006.01)
CPC H01P 5/16 (2013.01) [H01L 23/66 (2013.01); H01Q 21/0075 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6683 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A hybrid millimeter-wave Wilkinson divider device, comprising:
a carrier substrate,
an input port, a first output port, a second output port, and transmission lines connecting the input port to the first and second output ports implemented by transmission lines in the carrier substrate,
an isolation resistor connected between the first and second output ports, and the isolation resistor of the Wilkinson divider is integrated in a monolithic microwave integrated circuit (MMIC) chip installed on the carrier substrate, wherein the MMIC chip comprises a first input metal pad and a second input metal pad connected to first and second output ports, respectively, on the carrier substrate, and wherein the isolation resistor is connected between the first input metal pad and the second input metal pad in the MMIC chip, and the MMIC chip further comprises a first parallel resonant circuit for compensating a parasitic capacitance of the first input metal pad and a second parallel resonant circuit for compensating a parasitic capacitance of the second input metal pad.