US 12,142,712 B2
Radiation-emitting semiconductor component and method for producing radiation-emitting semiconductor component
Roland Heinrich Enzmann, Penang (MY); Hubert Halbritter, Dietfurt (DE); and Martin Rudolf Behringer, Regensburg (DE)
Assigned to OSRAM OLED GmbH, Regensburg (DE)
Filed by OSRAM OLED GmbH, Regensburg (DE)
Filed on Oct. 26, 2023, as Appl. No. 18/495,068.
Application 18/495,068 is a continuation of application No. 17/685,058, filed on Mar. 2, 2022, granted, now 11,848,406.
Application 17/685,058 is a continuation of application No. 16/650,100, granted, now 11,316,084, issued on Apr. 26, 2022, previously published as PCT/EP2018/075488, filed on Sep. 20, 2018.
Claims priority of application No. 102017122325.8 (DE), filed on Sep. 26, 2017.
Prior Publication US 2024/0055568 A1, Feb. 15, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 33/58 (2010.01); H01L 33/00 (2010.01); H01L 33/46 (2010.01); H01L 33/62 (2010.01)
CPC H01L 33/58 (2013.01) [H01L 33/0095 (2013.01); H01L 33/46 (2013.01); H01L 33/62 (2013.01); H01L 2933/0058 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A radiation-emitting semiconductor device comprising:
a semiconductor body having an active region provided for generating radiation;
a carrier on which the semiconductor body is arranged; and an optical element, wherein:
the optical element is attached to the semiconductor body with a direct bonding connection, and
a mirror region is arranged between the active region and the optical element,
wherein the radiation-emitting semiconductor device has two contacts for external electrical contacting on a side of the carrier facing away from the optical element.