US 12,142,711 B2
Light emitting diodes, components and related methods
Peter Scott Andrews, Durham, NC (US); Jesse Colin Reiherzer, Raleigh, NC (US); and Amber C. Abare, Durham, NC (US)
Assigned to CreeLED, Inc., Durham, NC (US)
Filed by CreeLED, Inc., Durham, NC (US)
Filed on Dec. 9, 2020, as Appl. No. 17/116,576.
Application 17/116,576 is a continuation of application No. 16/797,173, filed on Feb. 21, 2020, granted, now 10,879,435.
Application 16/797,173 is a continuation of application No. 16/380,400, filed on Apr. 10, 2019, granted, now 10,964,858.
Application 16/380,400 is a continuation of application No. 15/657,027, filed on Jul. 21, 2017, granted, now 10,290,777.
Claims priority of provisional application 62/366,961, filed on Jul. 26, 2016.
Prior Publication US 2021/0119090 A1, Apr. 22, 2021
Int. Cl. H01L 33/50 (2010.01); H01L 25/075 (2006.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H01L 33/54 (2010.01); H01L 33/56 (2010.01); H01L 33/58 (2010.01)
CPC H01L 33/507 (2013.01) [H01L 25/0753 (2013.01); H01L 33/502 (2013.01); H01L 33/505 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 33/501 (2013.01); H01L 33/54 (2013.01); H01L 33/56 (2013.01); H01L 33/58 (2013.01); H01L 2224/16225 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0091 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A light emitter device comprising:
a submount comprising an upper surface and a bottom surface;
one or more light emitters disposed on the upper surface of the submount, the one or more light emitters comprising an upper surface and one or more sides, wherein each light emitter of the one or more light emitters is a light-emitting diode (LED) chip comprising an active region supported by an LED chip substrate;
a light affecting material disposed on the upper surface of the submount and adjacent to the one or more sides of the one or more light emitters; and
a wavelength conversion component disposed on the upper surface of the one or more light emitters, wherein the wavelength conversion component comprises a substrate and a phosphor material supported by the substrate, and wherein a portion of the phosphor material is disposed on a sidewall of the substrate.