CPC H01L 29/66742 (2013.01) [H01L 29/158 (2013.01); H01L 29/41733 (2013.01); H01L 29/66439 (2013.01); H01L 29/775 (2013.01); H01L 29/78618 (2013.01); H01L 29/78696 (2013.01); H01L 29/42392 (2013.01)] | 20 Claims |
1. A method for making a semiconductor device comprising:
forming a plurality of spaced apart gate stacks on a substrate defining respective trenches therebetween, each gate stack comprising alternating layers of first and second semiconductor materials, the layers of the second semiconductor material defining nanostructures;
forming respective source/drain regions within the trenches;
forming respective insulating regions adjacent lateral ends of the layers of the first semiconductor material; and
forming respective dopant blocking superlattices adjacent lateral ends of the nanostructures and flush with adjacent surfaces of the insulating regions, each dopant blocking superlattice comprising a plurality of stacked groups of layers, each group of layers comprising a plurality of stacked base semiconductor monolayers defining a base semiconductor portion, and at least one non-semiconductor monolayer constrained within a crystal lattice of adjacent base semiconductor portions.
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