US 12,142,628 B2
Method of forming semiconductor device
Chi-Ming Lu, Kaohsiung (TW); Chih-Hui Huang, Tainan County (TW); Sheng-Chan Li, Tainan (TW); Jung-Chih Tsao, Hsin-Chu (TW); and Yao-Hsiang Liang, Shinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD, Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu (TW)
Filed on Jul. 7, 2022, as Appl. No. 17/859,834.
Application 17/859,834 is a division of application No. 16/680,043, filed on Nov. 11, 2019, granted, now 11,387,274.
Application 16/680,043 is a continuation of application No. 15/231,390, filed on Aug. 8, 2016, granted, now 10,475,847, issued on Nov. 12, 2019.
Claims priority of provisional application 62/329,077, filed on Apr. 28, 2016.
Prior Publication US 2022/0415959 A1, Dec. 29, 2022
Int. Cl. H01L 21/3213 (2006.01); H01L 21/285 (2006.01); H01L 21/3205 (2006.01); H01L 27/146 (2006.01)
CPC H01L 27/14685 (2013.01) [H01L 21/2855 (2013.01); H01L 21/28556 (2013.01); H01L 21/32051 (2013.01); H01L 21/32139 (2013.01); H01L 27/1462 (2013.01); H01L 27/14636 (2013.01); H01L 27/14621 (2013.01); H01L 27/14627 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
depositing a first metal layer over a backside of a substrate, wherein the first metal layer is formed entirely of a first metal material, the first metal material includes a first metal, and the first metal layer overlaps an image sensor element disposed in and at a frontside of the substrate;
depositing a second metal layer directly on the first metal layer, wherein the second metal layer is formed entirely of a second metal material, the second metal material includes a second metal and fluorine, and the second metal layer overlaps the image sensor element; and
patterning the first metal layer and the second metal layer to include an opening that is aligned with the image sensor element disposed in the substrate, wherein the patterning removes a portion of the first metal layer that overlaps the image sensor element and a portion of the second metal layer that overlaps the image sensor element.