US 12,142,615 B2
Electronic device
Yu-Lin Wang, Hsinchu (TW); and Wei-Tsung Chen, Hsinchu (TW)
Assigned to E Ink Holdings Inc., Hsinchu (TW)
Filed by E Ink Holdings Inc., Hsinchu (TW)
Filed on Apr. 1, 2022, as Appl. No. 17/657,632.
Claims priority of provisional application 63/178,539, filed on Apr. 23, 2021.
Prior Publication US 2022/0344378 A1, Oct. 27, 2022
Int. Cl. H01L 27/12 (2006.01); H01L 29/786 (2006.01)
CPC H01L 27/1244 (2013.01) [H01L 27/1225 (2013.01); H01L 27/124 (2013.01); H01L 27/1248 (2013.01); H01L 29/7869 (2013.01)] 17 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a substrate;
a first wiring layer, disposed on the substrate and comprising an outer metal layer, wherein the outer metal layer contains at least 97 wt % molybdenum;
an oxide insulating layer, disposed on the first wiring layer and touching the outer metal layer; and
a nitride insulating layer, disposed on the oxide insulating layer, wherein the oxide insulating layer is positioned between the nitride insulating layer and the outer metal layer, and a thickness difference between the thickness of the oxide insulating layer and the thickness of the nitride insulating layer is greater than or equal to 250 nm.