US 12,142,603 B2
Bonding of bridge to multiple semiconductor chips
Akihiro Horibe, Yokohama (JP); Takahito Watanabe, Yokohama (JP); Toyohiro Aoki, Yokohama (JP); Takashi Hisada, Hachiouji (JP); and Hiroyuki Mori, Yasu (JP)
Assigned to International Business Machines Corporation, Armonk, NY (US)
Filed by International Business Machines Corporation, Armonk, NY (US)
Filed on May 26, 2023, as Appl. No. 18/324,743.
Application 18/324,743 is a division of application No. 17/303,333, filed on May 27, 2021, granted, now 11,735,575.
Prior Publication US 2023/0299067 A1, Sep. 21, 2023
Int. Cl. H01L 25/00 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01)
CPC H01L 25/50 (2013.01) [H01L 23/538 (2013.01); H01L 24/75 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 2224/75101 (2013.01); H01L 2224/75755 (2013.01); H01L 2224/75981 (2013.01); H01L 2224/81054 (2013.01); H01L 2224/81136 (2013.01); H01L 2224/83951 (2013.01); H01L 2224/92125 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A method for interconnecting a first chip and a second chip, comprising:
mounting the first chip and the second chip to a chip handler having an opening and at least one support surface, each of the first chip and the second chip having a first surface including a first set of terminals and a second surface opposite to the first surface, wherein the first surface of the first chip and the first surface of the second chip mounted to the chip handler are supported by the at least one support surface of the chip handler;
placing the first chip and the second chip on a chip support member with the chip handler from the second surfaces; and
inserting a bridge member by a bridge handler through the opening of the chip handler to place the bridge member onto the first sets of terminals of the first chip and the first sets of terminals of the second chip that are exposed from the opening.