US 12,142,594 B2
Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices
Kuei-Wei Huang, Hsinchu (TW); Hsiu-Jen Lin, Zhubei (TW); Ai-Tee Ang, Hsinchu (TW); Ming-Da Cheng, Jhubei (TW); and Chung-Shi Liu, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Hsin-Chu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Jun. 6, 2022, as Appl. No. 17/833,262.
Application 17/833,262 is a division of application No. 16/051,235, filed on Jul. 31, 2018, granted, now 11,355,471.
Application 16/051,235 is a division of application No. 14/106,507, filed on Dec. 13, 2013, granted, now 10,109,612, issued on Oct. 23, 2018.
Prior Publication US 2022/0302079 A1, Sep. 22, 2022
Int. Cl. H01L 23/00 (2006.01)
CPC H01L 24/81 (2013.01) [H01L 24/75 (2013.01); H01L 24/97 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/11334 (2013.01); H01L 2224/11422 (2013.01); H01L 2224/11424 (2013.01); H01L 2224/1308 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/75101 (2013.01); H01L 2224/75252 (2013.01); H01L 2224/75253 (2013.01); H01L 2224/75283 (2013.01); H01L 2224/75651 (2013.01); H01L 2224/75754 (2013.01); H01L 2224/759 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/8113 (2013.01); H01L 2224/81132 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/8121 (2013.01); H01L 2224/8122 (2013.01); H01L 2224/81224 (2013.01); H01L 2224/8123 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/81805 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/97 (2013.01); H01L 2924/3511 (2013.01); Y10T 29/49144 (2015.01)] 19 Claims
OG exemplary drawing
 
1. A method of processing a semiconductor device, the method comprising:
attaching a first package component to a support, the first package component comprising a substrate with contact pads formed thereon;
disposing a tool over the first package component, the tool comprising an aperture configured to enclose the first package component, the tool comprising a reflective first surface most distal from the support, wherein the reflective first surface reflects radiation energy with a first wavelength, wherein the reflective first surface of the tool has a higher reflectivity to the radiation energy than a second surface opposite the first surface of the tool and the reflective first surface of the tool has a higher reflectivity to infrared (IR) energy at a different wavelength than the radiation energy than the second surface of the tool;
placing a second package component over the first package component within the aperture of the tool; and
exposing the tool and the second package component to the radiation energy.