US 12,142,584 B2
Semiconductor device package
Wen-Long Lu, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Aug. 8, 2023, as Appl. No. 18/231,774.
Application 18/231,774 is a continuation of application No. 17/078,070, filed on Oct. 22, 2020, granted, now 11,721,652.
Prior Publication US 2023/0387046 A1, Nov. 30, 2023
Int. Cl. H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/66 (2006.01); H01Q 1/38 (2006.01)
CPC H01L 23/66 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/4985 (2013.01); H01L 24/16 (2013.01); H01Q 1/38 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16227 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A semiconductor device package, comprising:
a first electronic component having a first surface, a second surface opposite to the first surface, and a first lateral surface extending between the first surface and the second surface;
a layer covering the first surface, the second surface, and the first lateral surface; and
a substrate connected to the first electronic component,
wherein the substrate comprises a first dielectric layer, a second dielectric layer disposed over the first dielectric layer, and a first antenna disposed over the second dielectric layer,
wherein the second dielectric layer has an opening exposing a bending portion of the first dielectric layer.