US 12,142,578 B2
Stiffener ring combined with ASIC power delivery
Xiaohong Wu, Santa Clara, CA (US); Xing Wang, Milpitas, CA (US); Mike Sapozhnikov, San Jose, CA (US); Sayed Ashraf Mamun, San Jose, CA (US); Tomer Osi, Rosh Ahayin (IL); and Joel Goergen, Soulsbyville, CA (US)
Assigned to CISCO TECHNOLOGY, INC., San Jose, CA (US)
Filed by Cisco Technology, Inc., San Jose, CA (US)
Filed on Oct. 4, 2021, as Appl. No. 17/492,836.
Prior Publication US 2023/0104301 A1, Apr. 6, 2023
Int. Cl. H01L 23/50 (2006.01); H01L 23/00 (2006.01); H01L 23/053 (2006.01); H01R 12/00 (2006.01); H05K 1/18 (2006.01); H05K 7/10 (2006.01)
CPC H01L 23/562 (2013.01) [H01L 23/053 (2013.01); H01L 23/50 (2013.01); H01R 12/00 (2013.01); H05K 1/181 (2013.01); H05K 7/10 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a printed circuit board (PCB); and
an integrated circuit (IC) package connected with the PCB, the IC package comprising:
a package substrate;
a die including an integrated circuit, the die secured to the package substrate; and
a stiffener ring secured to the package substrate and surrounding so as to define a perimeter around the die, wherein the stiffener ring increases a rigidity of the package substrate and delivers electrical power to the integrated circuit, wherein the stiffener ring comprises a first conductive layer forming a power (PWR) plane for the integrated circuit, a second conductive layer forming a ground (GND) plane for the integrated circuit, and an insulating layer disposed between the first conductive layer and the second conductive layer, wherein the first conductive layer, the second conductive layer and the insulating layer are arranged in a stacked manner in relation to each other and in relation to a mounting surface of the package substrate.