	US 12,142,564 B2
	Backside power distribution network semiconductor package and method of manufacturing the same
Saehan Park, Clifton Park, NY (US); Hoonseok Seo, Niskayuna, NY (US); Jeonghyuk Yim, Halfmoon, NY (US); Ki-Il Kim, Clifton Park, NY (US); and Gil Hwan Son, Clifton Park, NY (US)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Aug. 28, 2023, as Appl. No. 18/457,000.
Application 18/457,000 is a division of application No. 17/159,972, filed on Jan. 27, 2021, granted, now 11,769,728.
Claims priority of provisional application 63/113,631, filed on Nov. 13, 2020.
Prior Publication US 2023/0411294 A1, Dec. 21, 2023
Int. Cl. H01L 23/528 (2006.01); H01L 21/768 (2006.01); H01L 21/822 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 27/06 (2006.01)

CPC H01L 23/5286 (2013.01) [H01L 21/76898 (2013.01); H01L 21/8221 (2013.01); H01L 23/481 (2013.01); H01L 24/05 (2013.01); H01L 27/0694 (2013.01); H01L 2224/05025 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05157 (2013.01); H01L 2224/05176 (2013.01)]

11 Claims

1. A method of manufacturing a semiconductor architecture, the method comprising:

providing a wafer;

forming a landing pad in the wafer;

providing a first semiconductor device on a first surface of the wafer based on the landing pad such that a first component included in the first semiconductor device is provided on the landing pad;

removing a portion of a second surface of the wafer; and

providing a second semiconductor device on the second surface of the wafer based on the landing pad such that a second component protruding from the second semiconductor device is provided on the landing pad,

wherein the forming the landing pad in the wafer, the providing the first semiconductor device on the first surface of the wafer, and the providing the second semiconductor device of the second surface of the wafer are performed such that:

a width of a horizontal portion of a top surface of the landing pad contacting a bottom surface of the first component is greater than a width of the bottom surface the first component, and

a width of a horizontal portion of a bottom surface of the landing pad contacting a top surface of the second component is greater than a width of the top surface of the second component.