US 12,142,548 B2
Semiconductor package having mold locking feature
Yan Xun Xue, Los Gatos, CA (US); Long-Ching Wang, Cupertino, CA (US); Xiaoguang Zeng, Shanghai (CN); Mary Jane R. Alin, Shanghai (CN); Hailin Zhou, Shanghai (CN); and Guobing Shen, Shanghai (CN)
Assigned to ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP, Toronto (CA)
Filed by ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP, Toronto (CA)
Filed on Dec. 30, 2021, as Appl. No. 17/566,294.
Prior Publication US 2023/0215783 A1, Jul. 6, 2023
Int. Cl. H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/49503 (2013.01) [H01L 23/3107 (2013.01); H01L 23/49541 (2013.01); H01L 24/40 (2013.01); H01L 2224/40175 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A semiconductor package comprising:
a lead frame comprising
a first die paddle; and
one or more leads disposed along a first side of the first die paddle;
a chip mounted on the first die paddle; and
a molding encapsulation enclosing the chip;
wherein the first die paddle comprises:
one or more through holes aligned in parallel and approximate to a second side of the first die paddle opposite the first side of the first die paddle;
a first protrusion extending beyond an edge of the first die paddle at a third side orthogonal to the first and second sides;
a second protrusion extending beyond an edge of the first die paddle at a fourth side opposite to the third side;
wherein an entirety of the one or more through holes is filled with a first portion of the molding encapsulation
wherein the first protrusion comprises:
a first groove substantially aligned to the edge of the first die paddle at the third side separating a top surface of the first protrusion from a top surface of the first die paddle;
wherein an entirety of the first groove is filled with a second portion of the molding encapsulation;
wherein the second protrusion comprises:
a second groove substantially aligned to the edge of the first die paddle at the fourth side separating a top surface of the second protrusion from the top surface of the first die paddle;
wherein the first protrusion and the second protrusion are symmetric with respect to a centerline of a bottom surface of the semiconductor package;
wherein a portion of the top surface of the first protrusion is exposed from the molding encapsulation; and
wherein a portion of the top surface of the second protrusion is exposed from the molding encapsulation.