US 12,142,513 B2
Wafer processing tools and methods thereof
Jagan Rangarajan, Fremont, CA (US); Edward Golubovsky, San Jose, CA (US); Shaun Van Der Veen, San Jose, CA (US); Justin Ho Kuen Wong, Pleasanton, CA (US); and Steven M. Zuniga, Soquel, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Jul. 6, 2023, as Appl. No. 18/348,146.
Application 18/348,146 is a division of application No. 16/738,798, filed on Jan. 9, 2020, granted, now 11,749,552.
Claims priority of provisional application 62/794,556, filed on Jan. 18, 2019.
Prior Publication US 2023/0352337 A1, Nov. 2, 2023
Int. Cl. H01L 21/677 (2006.01); B24B 41/06 (2012.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/68707 (2013.01) [B24B 41/06 (2013.01); H01L 21/67028 (2013.01); H01L 21/67051 (2013.01); H01L 21/67703 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A load cup comprising:
a wafer station configured to receive a wafer, the wafer station moveable in a vertical direction between a first location where the wafer station is spaced from a wafer and a second location where a wafer is received by the wafer station; and
a notch in the wafer station, the notch sized to receive a portion of a blade configured to support a wafer as the wafer station moves between the first location and the second location.