US 12,142,507 B2
Systems and methods for air flow optimization in environment for semiconductor device
Yi-Fam Shiu, Miaoli County (TW); Cheng-Lung Wu, Miaoli County (TW); Yang-Ann Chu, Hsinchu (TW); Hsu-Shui Liu, Taoyuan County (TW); and Jiun-Rong Pai, Hsinchu County (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Jul. 25, 2023, as Appl. No. 18/358,517.
Application 18/358,517 is a continuation of application No. 17/465,040, filed on Sep. 2, 2021, granted, now 11,735,455.
Claims priority of provisional application 63/200,530, filed on Mar. 12, 2021.
Prior Publication US 2023/0386877 A1, Nov. 30, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/677 (2006.01); H01L 21/673 (2006.01)
CPC H01L 21/67772 (2013.01) [H01L 21/67393 (2013.01); H01L 21/67781 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system for semiconductor device processing, comprising:
a mini-environment;
a loading area for semiconductor wafers in the mini-environment, wherein the loading area includes an opening;
a fan filter unit (FFU) positioned above the loading area and operable provide an air flow in a vertical direction; and
an air flow optimizer device adjacent the opening and under the FFU, wherein the air flow optimizer device has an inlet opening and an outlet opening, wherein a channel extends between the inlet opening and the outlet opening, the inlet opening operable to accept the air flow in the vertical direction and the outlet opening operable to provide the air flow in an oblique direction away from the opening.