US 12,142,499 B2
Pickup apparatus and method of using the same
Yi-Jung Chen, Yilan County (TW); Tsung-Fu Tsai, Changhua County (TW); and Szu-Wei Lu, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Jan. 17, 2022, as Appl. No. 17/577,337.
Claims priority of provisional application 63/212,118, filed on Jun. 18, 2021.
Prior Publication US 2022/0406627 A1, Dec. 22, 2022
Int. Cl. H01L 21/67 (2006.01); H01L 21/683 (2006.01)
CPC H01L 21/67132 (2013.01) [H01L 21/6836 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68381 (2013.01)] 20 Claims
OG exemplary drawing
 
8. A pickup apparatus for separating a semiconductor die adhered on an adhesive film, comprising:
a frame, configured to hold the adhesive film adhered with the semiconductor die;
an UV light emitting element, disposed inside the frame, the adhesive film being disposed between the semiconductor die and the UV light emitting element, and the UV light emitting element being laterally overlapped with and laterally surrounded by the frame; and
a collector element, disposed over the frame to pick up the semiconductor die being disposed between the adhesive film and the collector element.