US 12,142,496 B2
Substrate processing apparatus and substrate processing method
Yoshifumi Amano, Koshi (JP); and Kazuhiro Aiura, Koshi (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on May 13, 2020, as Appl. No. 15/930,561.
Claims priority of application No. 2019-091600 (JP), filed on May 14, 2019.
Prior Publication US 2020/0365422 A1, Nov. 19, 2020
Int. Cl. H01L 21/67 (2006.01); B05B 9/00 (2006.01); B05C 5/02 (2006.01); B05C 11/10 (2006.01); H01L 21/68 (2006.01)
CPC H01L 21/6708 (2013.01) [B05B 9/00 (2013.01); B05C 5/0204 (2013.01); B05C 11/1013 (2013.01); H01L 21/67051 (2013.01); H01L 21/67253 (2013.01); H01L 21/67259 (2013.01); H01L 21/68 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A substrate processing apparatus, comprising:
a holder configured to hold a substrate;
a nozzle arm comprising a nozzle configured to supply a processing liquid to a peripheral portion of the substrate; and
a position adjusting device supported by the nozzle arm and configured to adjust a position of the substrate to a given position on the holder,
wherein the nozzle and the position adjusting device are provided at the same nozzle arm, and
the nozzle is disposed to extend from a processing liquid supply, which is located next to the position adjusting device, to a position between the position adjusting device and the substrate.