| CPC H01L 21/67051 (2013.01) [B01D 35/02 (2013.01)] | 16 Claims |

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1. A substrate processing apparatus comprising:
a nozzle unit configured to discharge a processing liquid to a substrate;
a pipe connected to the nozzle unit and a processing liquid supply unit supplying the processing liquid;
a charge amount control unit disposed at the pipe, including a filter unit charged with positive charges or negative charges, and including a control valve, controlling a flow rate of the processing liquid passing through an inside of the filter unit, and a power supply unit, applying a voltage to the filter unit, to control a charge amount of the processing liquid; and
a control unit connected to the charge amount control unit,
wherein the filter unit includes at least two filters charged with different charges,
wherein the pipe includes a first branch pipe and a second branch pipe branching off in parallel, and the filter unit includes a first filter, disposed at the first branch pipe and charged with positive charges, and a second filter disposed at the second branch pipe and charged with negative charges,
wherein the charge amount control unit includes the control valve disposed at a point, at which the first branch pipe and the second branch pipe are joined, and connected to the control unit to control a flow rate of a processing liquid passing through the first branch pipe and the second branch pipe.
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