US 12,142,483 B2
Substrate processing apparatus and substrate processing method
Yoshihiro Kawaguchi, Kumamoto (JP); Seiji Nakano, Kumamoto (JP); Munehisa Kodama, Kumamoto (JP); Hirotoshi Mori, Kumamoto (JP); Hayato Tanoue, Kumamoto (JP); and Yohei Yamawaki, Kumamoto (JP)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Appl. No. 17/295,480
Filed by Tokyo Electron Limited, Tokyo (JP)
PCT Filed Nov. 11, 2019, PCT No. PCT/JP2019/044082
§ 371(c)(1), (2) Date May 20, 2021,
PCT Pub. No. WO2020/105483, PCT Pub. Date May 28, 2020.
Claims priority of application No. 2018-218567 (JP), filed on Nov. 21, 2018; and application No. 2019-034954 (JP), filed on Feb. 27, 2019.
Prior Publication US 2021/0391177 A1, Dec. 16, 2021
Int. Cl. H01L 21/304 (2006.01); B24B 7/22 (2006.01); H01L 21/683 (2006.01)
CPC H01L 21/304 (2013.01) [B24B 7/228 (2013.01); H01L 21/683 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A substrate processing apparatus configured to process a substrate, comprising:
a substrate holder configured to hold, in a combined substrate in which a first substrate and a second substrate are bonded to each other, the second substrate;
a laser head configured to form a periphery modification layer in the first substrate along a boundary between a peripheral portion to be removed and a central portion of the first substrate by radiating a laser beam into the first substrate;
an insertion member having a shape in which a width of the insertion member decreases diametrically outwards when viewed from a side and configured to rotate about a vertical axis, and configured to be inserted between the first substrate and the second substrate and remove, starting from the periphery modification layer formed in the first substrate, the peripheral portion from the combined substrate held by the substrate holder; and
a collection unit equipped with a collection tray configured to collect the peripheral portion removed by the insertion member.