US 12,142,463 B2
Device and method for substrate transport in vacuum processing systems
Falk Milde, Dresden (DE)
Assigned to VON ARDENNE Asset GmbH &Co. KG, Dresden (DE)
Filed by VON ARDENNE Asset GmbH & Co. KG, Dresden (DE)
Filed on May 5, 2023, as Appl. No. 18/312,606.
Claims priority of application No. 10 2022 114 395.3 (DE), filed on Jun. 8, 2022; and application No. 10 2022 124 811.9 (DE), filed on Sep. 27, 2022.
Prior Publication US 2023/0402266 A1, Dec. 14, 2023
Int. Cl. H01J 37/32 (2006.01); C23C 14/34 (2006.01); C23C 16/50 (2006.01)
CPC H01J 37/32715 (2013.01) [C23C 14/34 (2013.01); C23C 16/50 (2013.01); H01J 37/32541 (2013.01); H01J 37/32568 (2013.01); H01J 2237/032 (2013.01); H01J 2237/201 (2013.01); H01J 2237/20221 (2013.01); H01J 2237/3321 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A substrate carrier comprising:
a support area;
a plurality of electrodes that are coupled to the support area and galvanically separated from one another;
a plurality of substrate carrying regions arranged consecutively in series with respect to one another, each substrate carrying region comprising:
an electrode of the plurality of electrodes; and
a substrate receiving device configured to receive a substrate placed in the substrate carrying region.