US 12,142,461 B2
Control and prediction of multiple plasma coupling surfaces and corresponding power transfer
David Coumou, Webster, NY (US); Zhi Wang, Sunnyvale, CA (US); Tao Zhang, San Ramon, CA (US); and David Peterson, San Jose, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on May 5, 2022, as Appl. No. 17/737,670.
Prior Publication US 2023/0360886 A1, Nov. 9, 2023
Int. Cl. H01J 37/32 (2006.01)
CPC H01J 37/32183 (2013.01) [H01J 37/32935 (2013.01); H01J 2237/332 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A process power controller for a plasma processing tool, comprising:
a process power source optimizer;
a source predictor;
a process uniformity controller, wherein the source predictor is communicatively coupled to the process power source optimizer and the process uniformity controller; and
a bias power controller comprising a process power bias optimizer, a bias predictor, and a process bias controller.