US 12,142,460 B2
Control of plasma sheath with bias supplies
Denis Shaw, Fort Collins, CO (US); Kevin Fairbairn, Los Gatos, CA (US); and Daniel Carter, Fort Collins, CO (US)
Assigned to Advanced Energy Industries, Inc., Denver, CO (US)
Filed by Advanced Energy Industries, Inc., Denver, CO (US)
Filed on Aug. 16, 2023, as Appl. No. 18/450,635.
Application 18/450,635 is a continuation of application No. 17/692,880, filed on Mar. 11, 2022, granted, now 11,842,884.
Application 17/692,880 is a continuation of application No. 16/896,709, filed on Jun. 9, 2020, granted, now 11,282,677, issued on Mar. 22, 2022.
Application 16/896,709 is a continuation of application No. 16/194,104, filed on Nov. 16, 2018, granted, now 10,707,055, issued on Jul. 7, 2020.
Claims priority of provisional application 62/588,224, filed on Nov. 17, 2017.
Prior Publication US 2023/0395354 A1, Dec. 7, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01J 37/32 (2006.01); H01L 21/67 (2006.01)
CPC H01J 37/32174 (2013.01) [H01J 37/32412 (2013.01); H01J 37/32477 (2013.01); H01J 37/32559 (2013.01); H01J 37/32568 (2013.01); H01J 37/32706 (2013.01); H01J 37/32935 (2013.01); H01L 21/67109 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system for plasma processing, the system comprising:
a processing chamber comprising a first electrical plane proximate to an inner zone in the processing chamber and a second electrical plane proximate to an outer zone in the processing chamber;
a first bias supply to provide a first asymmetric periodic voltage waveform to the first electrical plane;
a second bias supply to provide a second asymmetric periodic voltage waveform to the second electrical plane;
a controller to adjust one or more characteristics of the asymmetric periodic voltage waveforms to alter corresponding portions of a plasma sheath.