US 12,142,439 B2
Ceramic electronic component and method of manufacturing the same
Dong Jun Jung, Suwon-si (KR); Dae Hee Lee, Suwon-si (KR); Hyun Kim, Suwon-si (KR); and Yun Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Aug. 30, 2023, as Appl. No. 18/239,916.
Application 18/239,916 is a continuation of application No. 17/406,456, filed on Aug. 19, 2021, granted, now 11,784,004.
Claims priority of application No. 10-2020-0137682 (KR), filed on Oct. 22, 2020; and application No. 10-2021-0054242 (KR), filed on Apr. 27, 2021.
Prior Publication US 2023/0411080 A1, Dec. 21, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01G 4/30 (2006.01); C04B 35/468 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01)
CPC H01G 4/30 (2013.01) [C04B 35/468 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/1227 (2013.01); C04B 2235/6583 (2013.01); C04B 2235/66 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A ceramic electronic component comprising:
a body including a dielectric layer and an internal electrode; and
an external electrode disposed on the body and connected to the internal electrode,
wherein the dielectric layer includes a plurality of crystal grains and a grain boundary disposed between adjacent crystal grains,
wherein a ratio (C2/C1) of an Mg content (C2) of the grain boundary to an Mg content (C1) of at least one of the plurality of crystal grains is more than 1.571.