| CPC H01G 4/30 (2013.01) [H01G 2/065 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/1218 (2013.01)] | 7 Claims |

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1. An electronic component comprising:
an element body of a rectangular parallelepiped shape including a first principal surface arranged to constitute a mounting surface, a second principal surface opposing the first principal surface in a first direction, first and second side surfaces opposing each other in a second direction, and third and fourth side surfaces opposing each other in a third direction, the element body including a first corner including the first principal surface and the first and third side surfaces, a second corner including the first principal surface and the first and fourth side surfaces, a third corner including the first principal surface and the second and third side surfaces, and a fourth corner including the first principal surface and the second and fourth side surfaces;
a first conductive resin layer formed to cover the first corner;
a second conductive resin layer formed to cover the second corner;
a third conductive resin layer formed to cover the third corner; and
a fourth conductive resin layer formed to cover the fourth corner, wherein
the first, second, third, and fourth conductive resin layers are separated from each other.
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